AMD CEO Dr. Lisa Su is set to deliver the kickoff keynote for CES 2026 on Monday, January 5 at 9:30PM ET. The focus will be on AI advancements and likely new Ryzen CPUs, including the anticipated Ryzen 7 9850X3D.
At CES, Qualcomm unveiled the Snapdragon X2 Plus, a scaled-back version of its flagship laptop processor. It features either a six or ten-core CPU and an NPU for AI tasks, aiming for more affordable Copilot+ PCs.
Building chips in the US is proving brutally expensive for TSMC. Analyst data shows gross margins on US-made wafers are nearly eight times lower than in Taiwan, thanks to massive cost increases.
Samsung’s new 2nm Exynos 2600 chip is a major milestone. Reports indicate it’s the first with a GPU developed in-house by Samsung, a significant step toward independence.
Samsung is developing a new Exynos 5G modem with upgraded satellite communication features. This hardware is slated for the Galaxy S26 and S26+ phones in certain regions next year.
Samsung is riding the AI wave with its high-bandwidth memory chips. With Nvidia validating its tech and new production on the horizon, the company is locking in a crucial role in the AI supply chain.
Intel’s next-generation Panther Lake processors are already getting software support, long before launch. New Linux driver code reveals plans for up to 13 different mobile configurations.
According to a new report, Nvidia’s Blackwell Ultra GB300 AI servers are set to dominate hyperscaler orders in 2026. Shipments are forecast to skyrocket by 129% year-over-year. This massive ramp signals the next phase of the AI infrastructure arms race.
Samsung is set for a massive $73 billion operating profit from memory by 2026, thanks to the DRAM shortage. But a new report details why that financial boost still leaves its foundry business far behind industry leader TSMC.
Moore Threads has unveiled its new Yangtze AI SoC, designed to compete in the booming AI PC market. The chip features an 8-core CPU, a 50 TOPS NPU, and support for up to 64GB of fast memory.
